PMID- 20304554 OWN - NLM STAT- MEDLINE DCOM- 20100812 LR - 20131121 IS - 1873-3336 (Electronic) IS - 0304-3894 (Linking) VI - 179 IP - 1-3 DP - 2010 Jul 15 TI - Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards. PG - 203-7 LID - 10.1016/j.jhazmat.2010.02.080 [doi] AB - A new kind of wood plastic composite (WPC) was produced by compounding nonmetals from waste printed circuit boards (PCBs), recycled high-density polyethylene (HDPE), wood flour and other additives. The blended granules were then extruded to profile WPC products by a conical counter-rotating twin-screw extruder. The results showed that the addition of nonmetals in WPC improved the flexural strength and tensile strength and reduced screw withdrawal strength. When the added content of nonmetals was 40%, the flexural strength of WPC was 23.4 MPa, tensile strength was 9.6 MPa, impact strength was 3.03 J/m(2) and screw withdrawal strength was 1755 N. Dimensional stability and fourier transform infrared spectroscopy (FTIR) of WPC panels were also investigated. Furthermore, thermogravimetric analysis showed that thermal degradation of WPC mainly included two steps. The first step was the decomposition of wood flour and nonmetals from 260 to 380 degrees C, and the second step was the decomposition of HDPE from 440 to 500 degrees C. The performance and thermal behavior of WPC produced by nonmetals from PCBs achieves the standard of WPC. It offers a novel method to treat nonmetals from PCBs. CI - 2010 Elsevier B.V. All rights reserved. FAU - Guo, Jie AU - Guo J AD - School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, PR China. FAU - Tang, Yinen AU - Tang Y FAU - Xu, Zhenming AU - Xu Z LA - eng PT - Journal Article PT - Research Support, Non-U.S. Gov't DEP - 20100303 PL - Netherlands TA - J Hazard Mater JT - Journal of hazardous materials JID - 9422688 RN - 0 (Industrial Waste) RN - 0 (Plastics) RN - 0 (Polyethylenes) RN - DFC2HB4I0K (Polychlorinated Biphenyls) SB - IM MH - Absorption MH - Electronics MH - Industrial Waste/*analysis/economics MH - Industry MH - *Microcomputers MH - Microscopy, Electron, Scanning MH - Plastics/*analysis/economics MH - Polychlorinated Biphenyls/chemistry MH - Polyethylenes/analysis MH - Spectroscopy, Fourier Transform Infrared MH - Thermodynamics MH - Thermogravimetry MH - Wood/*analysis/economics EDAT- 2010/03/23 06:00 MHDA- 2010/08/13 06:00 CRDT- 2010/03/23 06:00 PHST- 2009/12/07 00:00 [received] PHST- 2010/02/05 00:00 [revised] PHST- 2010/02/24 00:00 [accepted] PHST- 2010/03/23 06:00 [entrez] PHST- 2010/03/23 06:00 [pubmed] PHST- 2010/08/13 06:00 [medline] AID - S0304-3894(10)00294-3 [pii] AID - 10.1016/j.jhazmat.2010.02.080 [doi] PST - ppublish SO - J Hazard Mater. 2010 Jul 15;179(1-3):203-7. doi: 10.1016/j.jhazmat.2010.02.080. Epub 2010 Mar 3.