PMID- 22772114 OWN - NLM STAT- PubMed-not-MEDLINE DCOM- 20121116 LR - 20181023 IS - 1539-4522 (Electronic) IS - 1559-128X (Linking) VI - 51 IP - 19 DP - 2012 Jul 1 TI - Optimization of a three-dimensional digital image correlation system for deformation measurements in extreme environments. PG - 4409-19 LID - 10.1364/AO.51.004409 [doi] AB - An optimized 3D digital image correlation (3D-DIC) system using active optical imaging is developed for accurate shape and 3D deformation measurements in nonlaboratory conditions or extreme high-temperature environments. In contrast to a conventional 3D-DIC system using white or natural light illumination, the proposed active imaging 3D-DIC system is based on a combination of monochromatic lighting and bandpass filter imaging. Because the bandpass filter attached before the imaging lenses allows only the actively illuminated monochromatic light to pass through and blocks all light outside of its bandpass range, the active imaging 3D-DIC system is therefore insensitive to serious variations in ambient light in nonlaboratory environments and to the thermal radiation of hot objects in extreme high-temperature environments. Two challenging experiments that cannot be performed by a conventional 3D-DIC system were carried out to verify the robustness and accuracy of the developed active imaging 3D-DIC system. Because a much wider application range can be achieved with relatively simple and easy-to-implement improvements, the proposed active imaging 3D-DIC system is highly recommended for practical use instead of the conventional 3D-DIC system. FAU - Pan, Bing AU - Pan B AD - Institute of Solid Mechanics, Beihang University, Beijing 100191, China. panb@buaa.edu.cn FAU - Wu, Dafang AU - Wu D FAU - Yu, Liping AU - Yu L LA - eng PT - Journal Article PL - United States TA - Appl Opt JT - Applied optics JID - 0247660 EDAT- 2012/07/10 06:00 MHDA- 2012/07/10 06:01 CRDT- 2012/07/10 06:00 PHST- 2012/07/10 06:00 [entrez] PHST- 2012/07/10 06:00 [pubmed] PHST- 2012/07/10 06:01 [medline] AID - 239257 [pii] AID - 10.1364/AO.51.004409 [doi] PST - ppublish SO - Appl Opt. 2012 Jul 1;51(19):4409-19. doi: 10.1364/AO.51.004409.