PMID- 25296670 OWN - NLM STAT- MEDLINE DCOM- 20161107 LR - 20191210 IS - 1862-278X (Electronic) IS - 0013-5585 (Linking) VI - 60 IP - 1 DP - 2015 Feb TI - Thermal, spectral, and surface properties of LED light-polymerized bulk fill resin composites. PG - 65-75 LID - 10.1515/bmt-2014-0052 [doi] AB - The aim of this study was to evaluate the thermal, spectral, and surface properties of four different bulk fill materials - SureFil SDR (SDR, Dentsplay DETREY), QuixFil (QF, Dentsplay DETREY), X-tra base (XB, Voco) X-tra fil (XF, Voco) - polymerized by light-emitting diode (LED). Resin matrix, filler type, size and amount, and photoinitiator types influence the degree of conversion. LED-cured bulk fill composites achieved sufficient polymerization. Scanning electron microscope (SEM) analysis revealed different patterns of surface roughness, depending on the composite material. Bulk fill materials showed surface characteristics similar to those of nanohybrid composites. Based on the thermal analysis results, glass transition (T(g)) and initial degradation (T(i)) temperatures changed depending on the bulk fill resin composites. FAU - Piskin, Mehmet Burcin AU - Piskin MB FAU - Atali, Pinar Yilmaz AU - Atali PY FAU - Figen, Aysel Kanturk AU - Figen AK LA - eng PT - Comparative Study PT - Evaluation Study PT - Journal Article PT - Research Support, Non-U.S. Gov't PL - Germany TA - Biomed Tech (Berl) JT - Biomedizinische Technik. Biomedical engineering JID - 1262533 RN - 0 (Composite Resins) RN - 0 (QuiXfil) SB - IM MH - Composite Resins/*chemistry/*radiation effects MH - Hardness/radiation effects MH - Light MH - Light-Curing of Dental Adhesives/*methods MH - Lighting/*methods MH - Materials Testing MH - Semiconductors MH - Surface Properties/radiation effects MH - Thermal Conductivity EDAT- 2014/10/10 06:00 MHDA- 2016/11/08 06:00 CRDT- 2014/10/10 06:00 PHST- 2014/01/14 00:00 [received] PHST- 2014/09/16 00:00 [accepted] PHST- 2014/10/10 06:00 [entrez] PHST- 2014/10/10 06:00 [pubmed] PHST- 2016/11/08 06:00 [medline] AID - /j/bmte.ahead-of-print/bmt-2014-0052/bmt-2014-0052.xml [pii] AID - 10.1515/bmt-2014-0052 [doi] PST - ppublish SO - Biomed Tech (Berl). 2015 Feb;60(1):65-75. doi: 10.1515/bmt-2014-0052.