PMID- 26553315
OWN - NLM
STAT- MEDLINE
DCOM- 20170424
LR  - 20170424
IS  - 1879-2456 (Electronic)
IS  - 0956-053X (Linking)
VI  - 57
DP  - 2016 Nov
TI  - Morphology, mechanical and thermal oxidative aging properties of HDPE composites 
      reinforced by nonmetals recycled from waste printed circuit boards.
PG  - 168-175
LID - S0956-053X(15)30189-6 [pii]
LID - 10.1016/j.wasman.2015.11.005 [doi]
AB  - In this study nonmetals recycled from waste printed circuit boards (NPCB) is used 
      as reinforce fillers in high-density polyethylene (HDPE) composites. The 
      morphology, mechanical and thermal oxidative aging properties of NPCB reinforced 
      HDPE composites are assessed and it compared with two other commercial functional 
      filler for the first time. Mechanical test results showed that NPCB could be used 
      as reinforcing fillers in the HDPE composites and mechanical properties 
      especially for stiffness is better than other two commercial fillers. The 
      improved mechanical property was confirmed by the higher aspect ratio and strong 
      interfacial adhesion in scanning electron microscopy (SEM) studies. The heat 
      deflection temperature (HDT) test showed the presence of fiberglass in NPCB can 
      improve the heat resistance of composite for their potential applications. 
      Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared 
      (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation 
      as two other commercial fillers used in this paper. The above results show the 
      reuse of NPCB in the HDPE composites represents a promising way for resolving 
      both the environmental pollution and the high-value reuse of resources.
CI  - Copyright (c) 2015. Published by Elsevier Ltd.
FAU - Yang, Shuangqiao
AU  - Yang S
AD  - State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute 
      of Sichuan University, Chengdu 610065, China.
FAU - Bai, Shibing
AU  - Bai S
AD  - State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute 
      of Sichuan University, Chengdu 610065, China. Electronic address: 
      baishibing@scu.edu.cn.
FAU - Wang, Qi
AU  - Wang Q
AD  - State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute 
      of Sichuan University, Chengdu 610065, China.
LA  - eng
PT  - Journal Article
DEP - 20151106
PL  - United States
TA  - Waste Manag
JT  - Waste management (New York, N.Y.)
JID - 9884362
RN  - 0 (Metals)
RN  - 0 (Waste Products)
SB  - IM
MH  - Construction Materials
MH  - *Electronic Waste
MH  - Hot Temperature
MH  - Metals
MH  - Microscopy, Electron, Scanning
MH  - Oxidation-Reduction
MH  - Recycling/*methods
MH  - Spectroscopy, Fourier Transform Infrared
MH  - Tensile Strength
MH  - *Waste Products
OTO - NOTNLM
OT  - Composites
OT  - Mechanical properties
OT  - Recycling
OT  - Waste printed circuit boards
EDAT- 2016/10/30 06:00
MHDA- 2017/04/25 06:00
CRDT- 2015/11/11 06:00
PHST- 2015/07/15 00:00 [received]
PHST- 2015/11/02 00:00 [revised]
PHST- 2015/11/02 00:00 [accepted]
PHST- 2016/10/30 06:00 [pubmed]
PHST- 2017/04/25 06:00 [medline]
PHST- 2015/11/11 06:00 [entrez]
AID - S0956-053X(15)30189-6 [pii]
AID - 10.1016/j.wasman.2015.11.005 [doi]
PST - ppublish
SO  - Waste Manag. 2016 Nov;57:168-175. doi: 10.1016/j.wasman.2015.11.005. Epub 2015 
      Nov 6.