PMID- 30424098
OWN - NLM
STAT- PubMed-not-MEDLINE
LR  - 20200930
IS  - 2072-666X (Print)
IS  - 2072-666X (Electronic)
IS  - 2072-666X (Linking)
VI  - 9
IP  - 4
DP  - 2018 Apr 2
TI  - PDMS-PDMS Micro Channels Filled with Phase-Change Material for Chip Cooling.
LID - 10.3390/mi9040165 [doi]
LID - 165
AB  - This paper reports on a chip cooling solution using polydimethylsiloxane (PDMS) 
      based microfluidic devices filled with n-Octadecane. A thick SU-8 layer of 150 microm 
      is used as the master mold for patterning PDMS fabrication. With the SU-8 mold, 
      patterns with straight lines at microscale have been fabricated with standard 
      micro-electro-mechanical system (MEMS) technology. Thermal polymer bonding 
      technique is used to bond the PDMS pattern directly to a flat 
      polydimethylsiloxane (PDMS) film which results in the sealed microchannels. 
      n-Octadecane as a phase-change material has been successfully filled in the 
      microchannels using a dispensing machine. Infrared thermal image shows a sharp 
      contrast of the temperature distribution between the chip with n-Octadecane and 
      the empty chip during the same heating process. This result indicates an 
      efficient cooling performance of the microchannel device with phase-change 
      material. A thermal stimulation test demonstrates that a 16  degrees C-lower temperature 
      difference can be achieved. This microchannel device, benefited from the 
      flexibility of PDMS substrate, shows specific advantages in meeting the need for 
      the heat dissipation of flexible electronics such as flexible displays, 
      electronic skins, and wearable electronics. Latent heat of the phase-change 
      material can keep the temperature of devices relatively lower over a period of 
      time, which shows potential application values on discontinuously active flexible 
      electronic devices.
FAU - Liu, Zong
AU  - Liu Z
AD  - Department of Electrical and Electronic Engineering, Southern University of 
      Science and Technology, Shenzhen 518055, China. victorliu612@gmail.com.
FAU - Qin, Siyin
AU  - Qin S
AUID- ORCID: 0000-0002-5376-1781
AD  - Shenzhen Key Laboratory of Polymer Science and Technology, College of Materials 
      Science and Engineering, Shenzhen University, Shenzhen 518055, China. 
      syqin@email.szu.edu.cn.
FAU - Chen, Xingwei
AU  - Chen X
AD  - Department of Electrical and Electronic Engineering, Southern University of 
      Science and Technology, Shenzhen 518055, China. chenxw@mail.sustc.edu.cn.
FAU - Chen, Dazhu
AU  - Chen D
AD  - Shenzhen Key Laboratory of Polymer Science and Technology, College of Materials 
      Science and Engineering, Shenzhen University, Shenzhen 518055, China. 
      dzchen@szu.edu.cn.
FAU - Wang, Fei
AU  - Wang F
AD  - Department of Electrical and Electronic Engineering, Southern University of 
      Science and Technology, Shenzhen 518055, China. wangf@sustc.edu.cn.
AD  - State Key Lab of Transducer Technology, Shanghai Institute of Microsystem and 
      Information Technology, Chinese Academy of Sciences, Shanghai 200050, China. 
      wangf@sustc.edu.cn.
LA  - eng
GR  - 51505209/National Natural Science Foundation of China/
GR  - JCYJ20170412154426330 and KQTD2015071710313656/Shenzhen Science and Technology 
      Innovation Committee/
GR  - 2015A030313812 and 2016A030306042/Guangdong Natural Science Funds/
GR  - 2014A030313561/Guangdong Natural Science Funds/
PT  - Journal Article
DEP - 20180402
PL  - Switzerland
TA  - Micromachines (Basel)
JT  - Micromachines
JID - 101640903
PMC - PMC6187480
OTO - NOTNLM
OT  - MEMS
OT  - chip cooling
OT  - flexible electronics
OT  - micro-channel device
OT  - phase-change material
OT  - polymer
OT  - thermal management
COIS- The authors declare no conflict of interest.
EDAT- 2018/11/15 06:00
MHDA- 2018/11/15 06:01
PMCR- 2018/04/02
CRDT- 2018/11/15 06:00
PHST- 2018/02/24 00:00 [received]
PHST- 2018/03/30 00:00 [revised]
PHST- 2018/04/01 00:00 [accepted]
PHST- 2018/11/15 06:00 [entrez]
PHST- 2018/11/15 06:00 [pubmed]
PHST- 2018/11/15 06:01 [medline]
PHST- 2018/04/02 00:00 [pmc-release]
AID - mi9040165 [pii]
AID - micromachines-09-00165 [pii]
AID - 10.3390/mi9040165 [doi]
PST - epublish
SO  - Micromachines (Basel). 2018 Apr 2;9(4):165. doi: 10.3390/mi9040165.