PMID- 32790276
OWN - NLM
STAT- PubMed-not-MEDLINE
LR  - 20200827
IS  - 1944-8252 (Electronic)
IS  - 1944-8244 (Linking)
VI  - 12
IP  - 34
DP  - 2020 Aug 26
TI  - Dense Assembly of Finely Patterned Semiconducting Single-Walled Carbon Nanotubes 
      via a Selective Transfer Method of Nanotube-Attracting Layers.
PG  - 38441-38450
LID - 10.1021/acsami.0c04612 [doi]
AB  - Development of technology for assembled single-walled carbon nanotube (SWCNT) 
      film with the fine resolution is an essential technique for penetrating practical 
      electronic applications. A promising approach is the assembly method by adding a 
      chemical-functionalizing substrate to enhance affinity between the SWCNTs and the 
      substrate. However, the various introduced approaches for solution-based assembly 
      have suffered from low SWCNT deposition selectivity or low SWCNT deposition 
      density. Herein, we demonstrated a facile method for selectively assembling 
      semiconducting SWCNT network on the substrate. The substrate was prepared via a 
      transfer printing of a poly-l-lysine (PLL)-coated poly(dimethylsiloxane) (PDMS) 
      stamp. The thermal-assisted transfer method enabled an ultrafine PLL pattern (</=4 
      mum) and a high transfer yield (96.5%) by only one-time stamping without a change 
      of the SWCNT-attracting nature. So, semiconducting SWCNTs were deposited on the 
      patterned regions selectively and precisely. The benefit of the patterned 
      semiconducting SWCNTs was lowering leakage current and turn-on voltage in the 
      transfer characteristics by suppressing attachment of unnecessary SWCNT network. 
      They showed excellent electrical performance, a log(10)(I(on)/I(off)) ratio of 
      4.76, and an average value of linear field-effect mobility of 7.56 cm(2)/(V s). 
      This research provides a simple but high-quality assembling technique of 
      semiconducting SWCNTs, thereby improving the feasibility of solution-processed 
      SWCNT-TFTs.
FAU - Park, Boik
AU  - Park B
AUID- ORCID: 0000-0003-1741-2063
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
FAU - Jang, Jongsu
AU  - Jang J
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
FAU - Kim, Hyeonggyu
AU  - Kim H
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
FAU - Seo, Jiseok
AU  - Seo J
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
FAU - Yoo, Hyunjun
AU  - Yoo H
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
FAU - Kim, Taehoon
AU  - Kim T
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
FAU - Hong, Yongtaek
AU  - Hong Y
AUID- ORCID: 0000-0001-9399-5948
AD  - Department of Electrical and Computer Engineering (ECE), Inter-University 
      Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, 
      Republic of Korea.
LA  - eng
PT  - Journal Article
DEP - 20200813
PL  - United States
TA  - ACS Appl Mater Interfaces
JT  - ACS applied materials & interfaces
JID - 101504991
SB  - IM
OTO - NOTNLM
OT  - SWCNT film
OT  - SWCNT-TFTs
OT  - transfer PLL film
OT  - ultrafine resolution
OT  - uniform assembly
EDAT- 2020/08/14 06:00
MHDA- 2020/08/14 06:01
CRDT- 2020/08/14 06:00
PHST- 2020/08/14 06:00 [pubmed]
PHST- 2020/08/14 06:01 [medline]
PHST- 2020/08/14 06:00 [entrez]
AID - 10.1021/acsami.0c04612 [doi]
PST - ppublish
SO  - ACS Appl Mater Interfaces. 2020 Aug 26;12(34):38441-38450. doi: 
      10.1021/acsami.0c04612. Epub 2020 Aug 13.