PMID- 32894742
OWN - NLM
STAT- PubMed-not-MEDLINE
LR  - 20200925
IS  - 1361-6528 (Electronic)
IS  - 0957-4484 (Linking)
VI  - 31
IP  - 47
DP  - 2020 Nov 20
TI  - Construction of low melting point alloy/graphene three-dimensional continuous 
      thermal conductive pathway for improving in-plane and through-plane thermal 
      conductivity of poly(vinylidene fluoride) composites.
PG  - 475709
LID - 10.1088/1361-6528/abaf82 [doi]
AB  - As the temperature of hot spots increases in electronic devices, thermal 
      management is a key issue for maintaining a device's reliability and performance. 
      The usual approaches of quickly extracting the heat from the hot spots have 
      focused on aligning two-dimensional filler along the in-plane orientation in the 
      polymer matrix. Meanwhile, improving the through-plane thermal conductivity of 
      polymer-based composites is as important as in-plane thermal conductivity. In 
      this study, poly(vinylidene fluoride) composites with three-dimensional 
      continuous thermal conductive pathways of a low melting point alloy 
      (LMPA)/graphene were prepared through a two-step method. Poly(vinylidene 
      fluoride)@graphene (PVDF@Gr) microspheres were firstly prepared by an in-situ 
      water-vapor induced phase separation method. Subsequently, PVDF@Gr/LMPA 
      composites were obtained by hot-pressing after mixing the LMPA with the PVDF@Gr 
      microspheres. Attributed to the unique solid-liquid phase transition advantage of 
      the LMPA and the good matching of the phonon power spectrum between the LMPA and 
      the graphene, the PVDF@4.8Gr/10LMPA composites with 4.8 vol% graphene and 10.0 
      vol% LMPA exhibited an outstanding in-plane thermal conductivity of 9.41 W m(-1) 
      K(-1) and through-plane thermal conductivity of 0.35 W m(-1) K(-1), which was 
      nearly increased by 245% and 130% compared to that of the PVDF@4.8Gr composites, 
      respectively. The enhanced elasticity modulus and reduced thermal expansion 
      coefficient were attributed to the LMPA constructing a three-dimensional 
      continuous thermal conductive pathway along with the graphene and reducing 
      interface thermal resistance. This study offeres a straightforward and repeatable 
      method for fabricating highly thermally conductive polymer composites and widens 
      the application of LMPAs in the fields of thermal management.
FAU - Zhang, Ping
AU  - Zhang P
AD  - Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese 
      Academy of Sciences, Hefei 230031, People's Republic of China. University of 
      Science and Technology of China, Hefei 262300, People's Republic of China. Key 
      Laboratory of Photovolatic and Energy Conservation Materials, Chinese Academy of 
      Sciences, Hefei 230088, People's Republic of China.
FAU - Zhang, Xian
AU  - Zhang X
FAU - Ding, Xin
AU  - Ding X
FAU - Wang, Yanyan
AU  - Wang Y
FAU - Shu, Mengting
AU  - Shu M
FAU - Zeng, Xiaoliang
AU  - Zeng X
FAU - Gong, Yi
AU  - Gong Y
FAU - Zheng, Kang
AU  - Zheng K
FAU - Tian, Xingyou
AU  - Tian X
LA  - eng
PT  - Journal Article
PL  - England
TA  - Nanotechnology
JT  - Nanotechnology
JID - 101241272
SB  - IM
EDAT- 2020/09/08 06:00
MHDA- 2020/09/08 06:01
CRDT- 2020/09/07 17:05
PHST- 2020/09/08 06:00 [pubmed]
PHST- 2020/09/08 06:01 [medline]
PHST- 2020/09/07 17:05 [entrez]
AID - 10.1088/1361-6528/abaf82 [doi]
PST - ppublish
SO  - Nanotechnology. 2020 Nov 20;31(47):475709. doi: 10.1088/1361-6528/abaf82.