PMID- 33034396
OWN - NLM
STAT- PubMed-not-MEDLINE
LR  - 20210211
IS  - 1365-2818 (Electronic)
IS  - 0022-2720 (Linking)
VI  - 281
IP  - 3
DP  - 2021 Mar
TI  - Relations between electron yield and temperature rise under low-energy electron 
      irradiation for Au element.
PG  - 255-264
LID - 10.1111/jmi.12969 [doi]
AB  - Scanning electron microscope (SEM) is a widely used tool for analysing the 
      micro/nanoscale structural information. In the process of the SEM imaging, the 
      temperature rise caused by the electron beam bombardment has already become an 
      issue because the SEM results might thus be modified by it as the specimen 
      downsizes. This work aims to explore the relationship between the total electron 
      yield (TEY) and the temperature rise in order to directly evaluate the heat 
      accumulation inside the solid during the imaging using a Monte Carlo (MC) 
      simulation. The rules of profiles of the TEY and the temperature rise integral 
      with various primary electron (PE) beam energies and incident angles were first 
      investigated focusing on a semi-infinite gold (Au) bulk. Based on this rule, it 
      is concluded that, with the increase of the TEY, the temperature rise integral 
      decreases almost linearly (As the PE energy getting larger, the linear 
      correlation is more obvious). In addition, this result was also applied to 
      evaluate the heat built up for two specific SEM imaging examples: nanoscale Au 
      balls and arbitrary shaped Au particles on a carbon (C) substrate. Their 
      temperature contour maps present an almost inverse contrast compared with their 
      respective SEM images. Furthermore, the influence of external electric field 
      (full extraction and no extraction modes) for thermal effect was discussed. It is 
      concluded that the full extraction mode can effectively avoid the local 
      overheating. The mechanism of these observations was explained in detail. On the 
      one hand, this work gives a better elucidation and understanding for physical 
      mechanism of electron-beam-induced deposition, of which reliability, process 
      control and performance can thus be greatly improved. On the other hand, because 
      some damages caused by nonuniform heat accumulation in various local geometric 
      structures of specimen during imaging process could be effectively analysed and 
      even reduced, this work thus greatly benefits for the analysis of the correlation 
      between thermal effect and the structures of samples.
CI  - (c) 2020 Royal Microscopical Society.
FAU - Zhang, P
AU  - Zhang P
AUID- ORCID: 0000-0002-8029-1041
AD  - School of Electronic Information Engineering, Yangtze Normal University, 
      Chongqing, P.R. China.
FAU - Zhang, L D
AU  - Zhang LD
AD  - School of Robot Engineering, Yangtze Normal University, Chongqing, P.R. China.
LA  - eng
GR  - KJQN201901407/the Youth Project of Science and Technology Research Program of 
      Chongqing Education Commission of China/
GR  - No. 2017KYQD113/the start-up research funding of Yangtze Normal University, 
      China/
GR  - 2017QNRC18/Youth Research Talent Supporting Program, China/
PT  - Journal Article
DEP - 20201020
PL  - England
TA  - J Microsc
JT  - Journal of microscopy
JID - 0204522
SB  - IM
OTO - NOTNLM
OT  - Electron yields
OT  - heat transfer
OT  - simulation
OT  - thermal of electron beam
EDAT- 2020/10/10 06:00
MHDA- 2020/10/10 06:01
CRDT- 2020/10/09 08:37
PHST- 2020/08/04 00:00 [received]
PHST- 2020/09/17 00:00 [revised]
PHST- 2020/10/07 00:00 [accepted]
PHST- 2020/10/10 06:00 [pubmed]
PHST- 2020/10/10 06:01 [medline]
PHST- 2020/10/09 08:37 [entrez]
AID - 10.1111/jmi.12969 [doi]
PST - ppublish
SO  - J Microsc. 2021 Mar;281(3):255-264. doi: 10.1111/jmi.12969. Epub 2020 Oct 20.