PMID- 33530451 OWN - NLM STAT- PubMed-not-MEDLINE LR - 20210303 IS - 2072-666X (Print) IS - 2072-666X (Electronic) IS - 2072-666X (Linking) VI - 12 IP - 2 DP - 2021 Jan 26 TI - The Influence of the Different Repair Methods on the Electrical Properties of the Normally off p-GaN HEMT. LID - 10.3390/mi12020131 [doi] LID - 131 AB - The influence of the repair process on the electrical properties of the normally off p-GaN high-electron-mobility transistor (HEMT) is studied in detail in this paper. We find that the etching process will cause the two-dimensional electron gas (2DEG) and the mobility of the p-GaN HEMT to decrease. However, the repair process will gradually recover the electrical properties. We study different repair methods and different repair conditions, propose the best repair conditions, and further fabricate the p-GaN HEMTs devices. The threshold voltage of the fabricated device is 1.6 V, the maximum gate voltage is 7 V, and the on-resistance is 23 Omega.mm. The device has a good performance, which proves that the repair conditions can be successfully applied to the fabricate of the p-GaN HEMT devices. FAU - Niu, Di AU - Niu D AUID- ORCID: 0000-0002-8409-618X AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Wang, Quan AU - Wang Q AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. AD - State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China. FAU - Li, Wei AU - Li W AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Chen, Changxi AU - Chen C AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Xu, Jiankai AU - Xu J AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Jiang, Lijuan AU - Jiang L AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Feng, Chun AU - Feng C AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Xiao, Hongling AU - Xiao H AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Wang, Qian AU - Wang Q AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. FAU - Xu, Xiangang AU - Xu X AD - State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China. FAU - Wang, Xiaoliang AU - Wang X AUID- ORCID: 0000-0003-4559-0553 AD - Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. AD - Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. AD - School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China. AD - Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China. LA - eng PT - Journal Article DEP - 20210126 PL - Switzerland TA - Micromachines (Basel) JT - Micromachines JID - 101640903 PMC - PMC7911281 OTO - NOTNLM OT - different repair methods OT - p-GaN high-electron-mobility transistor (HEMT) OT - repair process COIS- The authors declare no conflict of interest. EDAT- 2021/02/04 06:00 MHDA- 2021/02/04 06:01 PMCR- 2021/01/26 CRDT- 2021/02/03 01:01 PHST- 2020/12/29 00:00 [received] PHST- 2021/01/22 00:00 [revised] PHST- 2021/01/24 00:00 [accepted] PHST- 2021/02/03 01:01 [entrez] PHST- 2021/02/04 06:00 [pubmed] PHST- 2021/02/04 06:01 [medline] PHST- 2021/01/26 00:00 [pmc-release] AID - mi12020131 [pii] AID - micromachines-12-00131 [pii] AID - 10.3390/mi12020131 [doi] PST - epublish SO - Micromachines (Basel). 2021 Jan 26;12(2):131. doi: 10.3390/mi12020131.