PMID- 34361318 OWN - NLM STAT- PubMed-not-MEDLINE LR - 20210809 IS - 1996-1944 (Print) IS - 1996-1944 (Electronic) IS - 1996-1944 (Linking) VI - 14 IP - 15 DP - 2021 Jul 24 TI - Experimental Investigation of the Apparent Thermal Conductivity of Microencapsulated Phase-Change-Material Slurry at the Phase-Transition Temperature. LID - 10.3390/ma14154124 [doi] LID - 4124 AB - The article presents the results of detailed studies of the thermal conductivity of the water slurry of microencapsulated PCM (mPCM) and slurry based on water-propylene glycol solutions. The starting product, MICRONAL((R)) 5428 X, which contains about 43% microencapsulated paraffin with a transformation temperature of 28 degrees C, was mixed with the base liquid to obtain slurries with mass fractions of mPCM of 4.3, 8.6, 12.9, 17.2, 21.5, 25.8, 30.1, 34.4, 38.7, and 43.0%. Detailed measurements were carried out in the temperature range of 10-40 degrees C. It was found that: (a) an increase in the temperature of the slurry caused an increase in its thermal conductivity, both when PCM was in the form of a solid and a liquid; (b) the thermal conductivity of the mPCM slurry when the PCM was in liquid form was greater than the thermal conductivity of the slurry when the PCM was liquid; (c) during the phase transformation, a significant increase in the thermal conductivity of the slurry was observed, and its peak occurred when the temperature of the slurry reached the temperature declared by the manufacturer at which the phase-transition peak occurs. FAU - Dutkowski, Krzysztof AU - Dutkowski K AUID- ORCID: 0000-0003-3945-9882 AD - Faculty of Mechanical Engineering, Koszalin University of Technology, ul. Raclawicka 15-17, 75-620 Koszalin, Poland. FAU - Kruzel, Marcin AU - Kruzel M AUID- ORCID: 0000-0001-8349-1375 AD - Faculty of Mechanical Engineering, Koszalin University of Technology, ul. Raclawicka 15-17, 75-620 Koszalin, Poland. LA - eng PT - Journal Article DEP - 20210724 PL - Switzerland TA - Materials (Basel) JT - Materials (Basel, Switzerland) JID - 101555929 PMC - PMC8347062 OTO - NOTNLM OT - PCM OT - experimental investigation OT - microencapsulation OT - thermal conductivity COIS- The authors declare no conflict of interest. The funders had no role in the design of the study; in the collection, analyses, or interpretation of data; in the writing of the manuscript, or in the decision to publish the results. EDAT- 2021/08/08 06:00 MHDA- 2021/08/08 06:01 PMCR- 2021/07/24 CRDT- 2021/08/07 01:09 PHST- 2021/06/14 00:00 [received] PHST- 2021/07/20 00:00 [revised] PHST- 2021/07/22 00:00 [accepted] PHST- 2021/08/07 01:09 [entrez] PHST- 2021/08/08 06:00 [pubmed] PHST- 2021/08/08 06:01 [medline] PHST- 2021/07/24 00:00 [pmc-release] AID - ma14154124 [pii] AID - materials-14-04124 [pii] AID - 10.3390/ma14154124 [doi] PST - epublish SO - Materials (Basel). 2021 Jul 24;14(15):4124. doi: 10.3390/ma14154124.