PMID- 34641211 OWN - NLM STAT- PubMed-not-MEDLINE LR - 20211016 IS - 2073-4360 (Electronic) IS - 2073-4360 (Linking) VI - 13 IP - 19 DP - 2021 Oct 2 TI - Material Modeling of PMMA Film for Hot Embossing Process. LID - 10.3390/polym13193398 [doi] LID - 3398 AB - This study provides an analysis of the hot embossing process with poly methyl methacrylate (PMMA) film. The hot embossing process engraves a fine pattern on a flexible film using a stamp, applied heat and pressure. As the quality of the embossing pattern varies according to various process variables, the mechanism of making the embossed shape is complicated and difficult to analyze. Therefore, analysis takes much time and cost because it usually has to perform a lot of experiments to find an appropriate process condition. In this paper, the hot embossing process was analyzed using a computational analysis method to quickly find the optimal process. To do this, we analyzed the embossing phenomenon using the finite element method (FEM) and arbitrary Lagrangian-Eulerian (ALE) re-mesh technique. For this purpose, we developed a constitutive model considering the strain, strain rate, temperature-dependent stress and softening of the flexible film. Work hardening, strain softening, and temperature-softening behavior of PMMA materials were well described by the proposed method. The developed constitutive model were applied in the embossing analysis via user-subroutine. This proposed method allowed a precise analysis of the phenomenon of film change during the hot embossing process. FAU - Yun, Dongwon AU - Yun D AUID- ORCID: 0000-0003-2254-5274 AD - Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology, 333 Techno jungang-daero Hyeonpung, Dalseong-gun, Daegu 42988, Korea. FAU - Kim, Jong-Bong AU - Kim JB AUID- ORCID: 0000-0002-7854-293X AD - Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-Gu, Seoul 01811, Korea. LA - eng PT - Journal Article DEP - 20211002 PL - Switzerland TA - Polymers (Basel) JT - Polymers JID - 101545357 PMC - PMC8512687 OTO - NOTNLM OT - Poly methyl methacrylate OT - constitutive model OT - embossing OT - finite element method OT - polymer COIS- The authors declare no conflict of interest. EDAT- 2021/10/14 06:00 MHDA- 2021/10/14 06:01 PMCR- 2021/10/02 CRDT- 2021/10/13 01:13 PHST- 2021/08/30 00:00 [received] PHST- 2021/09/25 00:00 [revised] PHST- 2021/09/28 00:00 [accepted] PHST- 2021/10/13 01:13 [entrez] PHST- 2021/10/14 06:00 [pubmed] PHST- 2021/10/14 06:01 [medline] PHST- 2021/10/02 00:00 [pmc-release] AID - polym13193398 [pii] AID - polymers-13-03398 [pii] AID - 10.3390/polym13193398 [doi] PST - epublish SO - Polymers (Basel). 2021 Oct 2;13(19):3398. doi: 10.3390/polym13193398.