PMID- 35630215 OWN - NLM STAT- PubMed-not-MEDLINE LR - 20220716 IS - 2072-666X (Print) IS - 2072-666X (Electronic) IS - 2072-666X (Linking) VI - 13 IP - 5 DP - 2022 May 9 TI - Investigation on Capacitance Collapse Induced by Secondary Capture of Acceptor Traps in AlGaN/GaN Lateral Schottky Barrier Diode. LID - 10.3390/mi13050748 [doi] LID - 748 AB - In this study, a dedicated dynamic measurement system was used to investigate the transient capacitance and recovery process of AlGaN/GaN lateral Schottky barrier diodes (SBDs). With the consideration of acceptor traps in the C-doped buffer, the C-V characteristics and transient capacitance were measured and analyzed, and the results were simulated and explained by Silvaco TCAD (technology computer aided design). The ionization of acceptor traps and the change of electric potential were monitored in transient simulation to investigate the origin of the capacitance collapse in the SBD. The results suggest the significant impact of traps in the GaN buffer layer on the capacitance collapse of the device, and the secondary capture effect on the variation of acceptor ionization. Based on the study of transient capacitance of SBD, this work could be extended to the Miller capacitance in high electron mobility transistor (HEMT) devices. Moreover, the report on the stability of capacitance is essential for GaN devices, and could be further extended to other aspects of device research. FAU - Zhang, Haitao AU - Zhang H AUID- ORCID: 0000-0002-6940-7031 AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. AD - School of Electronic Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China. FAU - Kang, Xuanwu AU - Kang X AUID- ORCID: 0000-0003-0607-2948 AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. FAU - Zheng, Yingkui AU - Zheng Y AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. FAU - Wei, Ke AU - Wei K AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. FAU - Wu, Hao AU - Wu H AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. AD - The Institute of Future Lighting, Academy for Engineering and Technology, Fudan University (FAET), Shanghai 200433, China. FAU - Liu, Xinyu AU - Liu X AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. FAU - Ye, Tianchun AU - Ye T AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. FAU - Jin, Zhi AU - Jin Z AD - High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China. LA - eng GR - 61804172/National Natural Science Foundation of China/ GR - 2019B010128001/Key-Area Research and Development Program of the GuangDong Province/ PT - Journal Article DEP - 20220509 PL - Switzerland TA - Micromachines (Basel) JT - Micromachines JID - 101640903 PMC - PMC9147414 OTO - NOTNLM OT - GaN OT - SBD OT - Schottky barrier diode OT - acceptor trap OT - capacitance collapse OT - depletion OT - potential OT - secondary capture OT - simulation COIS- The authors declare no conflict of interest. EDAT- 2022/05/29 06:00 MHDA- 2022/05/29 06:01 PMCR- 2022/05/09 CRDT- 2022/05/28 01:32 PHST- 2022/03/31 00:00 [received] PHST- 2022/05/05 00:00 [revised] PHST- 2022/05/06 00:00 [accepted] PHST- 2022/05/28 01:32 [entrez] PHST- 2022/05/29 06:00 [pubmed] PHST- 2022/05/29 06:01 [medline] PHST- 2022/05/09 00:00 [pmc-release] AID - mi13050748 [pii] AID - micromachines-13-00748 [pii] AID - 10.3390/mi13050748 [doi] PST - epublish SO - Micromachines (Basel). 2022 May 9;13(5):748. doi: 10.3390/mi13050748.