PMID- 36556876 OWN - NLM STAT- PubMed-not-MEDLINE LR - 20230308 IS - 1996-1944 (Print) IS - 1996-1944 (Electronic) IS - 1996-1944 (Linking) VI - 15 IP - 24 DP - 2022 Dec 19 TI - Remarkable Reduction in I(G) with an Explicit Investigation of the Leakage Conduction Mechanisms in a Dual Surface-Modified Al(2)O(3)/SiO(2) Stack Layer AlGaN/GaN MOS-HEMT. LID - 10.3390/ma15249067 [doi] LID - 9067 AB - We demonstrated the performance of an Al2O3/SiO2 stack layer AlGaN/GaN metal-oxide semiconductor (MOS) high-electron-mobility transistor (HEMT) combined with a dual surface treatment that used tetramethylammonium hydroxide (TMAH) and hydrochloric acid (HCl) with post-gate annealing (PGA) modulation at 400 degrees C for 10 min. A remarkable reduction in the reverse gate leakage current (IG) up to 1.5x10-12 A/mm (@ VG = -12 V) was observed in the stack layer MOS-HEMT due to the combined treatment. The performance of the dual surface-treated MOS-HEMT was significantly improved, particularly in terms of hysteresis, gate leakage, and subthreshold characteristics, with optimized gate annealing treatment. In addition, an organized gate leakage conduction mechanism in the AlGaN/GaN MOS-HEMT with the Al2O3/SiO2 stack gate dielectric layer was investigated before and after gate annealing treatment and compared with the conventional Schottky gate. The conduction mechanism in the reverse gate bias was Poole-Frankel emission for the Schottky-gate HEMT and the MOS-HEMT before annealing. The dominant conduction mechanism was ohmic/Poole-Frankel at low/medium forward bias. Meanwhile, gate leakage was governed by the hopping conduction mechanism in the MOS-HEMT without gate annealing modulation at a higher forward bias. After post-gate annealing (PGA) treatment, however, the leakage conduction mechanism was dominated by trap-assisted tunneling at the low to medium forward bias region and by Fowler-Nordheim tunneling at the higher forward bias region. Moreover, a decent product of maximum oscillation frequency and gate length (fmax x LG) was found to reach 27.16 GHz∙microm for the stack layer MOS-HEMT with PGA modulation. The dual surface-treated Al2O3/SiO2 stack layer MOS-HEMT with PGA modulation exhibited decent performance with an IDMAX of 720 mA/mm, a peak extrinsic transconductance (GMMAX) of 120 mS/mm, a threshold voltage (VTH) of -4.8 V, a higher ION/IOFF ratio of approximately 1.2x109, a subthreshold swing of 82 mV/dec, and a cutoff frequency(ft)/maximum frequency of (fmax) of 7.5/13.58 GHz. FAU - Mazumder, Soumen AU - Mazumder S AUID- ORCID: 0000-0002-4386-4752 AD - Department of Electrical Engineering, Institute of Microelectronics, National Cheng-Kung University, Tainan 701, Taiwan. FAU - Pal, Parthasarathi AU - Pal P AUID- ORCID: 0000-0002-4888-9596 AD - Department of Electrical Engineering, Institute of Microelectronics, National Cheng-Kung University, Tainan 701, Taiwan. FAU - Lee, Kuan-Wei AU - Lee KW AUID- ORCID: 0000-0002-1065-0889 AD - Department of Electronic Engineering, I-Shou University, Kaohsiung 840, Taiwan. FAU - Wang, Yeong-Her AU - Wang YH AUID- ORCID: 0000-0002-5898-7229 AD - Department of Electrical Engineering, Institute of Microelectronics, National Cheng-Kung University, Tainan 701, Taiwan. LA - eng GR - MOST 106-2221-E-006-219-MY3/Ministry of Science and Technology, Taiwan/ GR - MOST 109-2221-E-06-075-MY2/Ministry of Science and Technology/ GR - 109S0172/Transcom Inc., Taiwan/ GR - 2021-T-01/Materials Analysis Technology Inc./ PT - Journal Article DEP - 20221219 PL - Switzerland TA - Materials (Basel) JT - Materials (Basel, Switzerland) JID - 101555929 PMC - PMC9788628 OTO - NOTNLM OT - Al2O3/SiO2 OT - AlGaN/GaN OT - MOS-HEMT OT - post-gate annealing (PGA) COIS- The authors declare no conflict of interest. EDAT- 2022/12/24 06:00 MHDA- 2022/12/24 06:01 PMCR- 2022/12/19 CRDT- 2022/12/23 01:43 PHST- 2022/10/25 00:00 [received] PHST- 2022/11/25 00:00 [revised] PHST- 2022/12/14 00:00 [accepted] PHST- 2022/12/23 01:43 [entrez] PHST- 2022/12/24 06:00 [pubmed] PHST- 2022/12/24 06:01 [medline] PHST- 2022/12/19 00:00 [pmc-release] AID - ma15249067 [pii] AID - materials-15-09067 [pii] AID - 10.3390/ma15249067 [doi] PST - epublish SO - Materials (Basel). 2022 Dec 19;15(24):9067. doi: 10.3390/ma15249067.