PMID- 37299607
OWN - NLM
STAT- PubMed-not-MEDLINE
LR  - 20230612
IS  - 2079-4991 (Print)
IS  - 2079-4991 (Electronic)
IS  - 2079-4991 (Linking)
VI  - 13
IP  - 11
DP  - 2023 May 23
TI  - Upconversion Nanoparticle-Based Fluorescent Film for Distributed Temperature 
      Monitoring of Mobile Phones' Integrated Chips.
LID - 10.3390/nano13111704 [doi]
LID - 1704
AB  - As one of the most critical parameters to evaluate the quality and performance of 
      mobile phones, real-time temperature monitoring of mobile phones' integrated 
      chips is vital in the electronics industry. Although several different strategies 
      for the measurement of chips' surface temperature have been proposed in recent 
      years, distributed temperature monitoring with high spatial resolution is still a 
      hot issue with an urgent need to be solved. In this work, a fluorescent film 
      material with photothermal properties containing thermosensitive upconversion 
      nanoparticles (UCNPs) and polydimethylsiloxane (PDMS) is fabricated for the 
      monitoring of the chips' surface temperature. The presented fluorescent films 
      have thicknesses ranging from 23 to 90 mum and are both flexible and elastic. 
      Using the fluorescence intensity ratio (FIR) technique, the temperature-sensing 
      properties of these fluorescent films are investigated. The maximum sensitivity 
      of the fluorescent film was measured to be 1.43% K(-1) at 299 K. By testing the 
      temperature at different positions of the optical film, distributed temperature 
      monitoring with a high spatial resolution down to 10 mum on the chip surface was 
      successfully achieved. It is worth mentioning that the film maintained stable 
      performance even under pull stretching up to 100%. The correctness of the method 
      is verified by taking infrared images of the chip surface with an infrared 
      camera. These results demonstrate that the as-prepared optical film is a 
      promising anti-deformation material for monitoring temperature with high spatial 
      resolution on-chip surfaces.
FAU - Li, Hanyang
AU  - Li H
AD  - College of Physics and Optoelectronic Engineering, Harbin Engineering University, 
      Harbin 150001, China.
FAU - Yu, Miao
AU  - Yu M
AD  - College of Physics and Optoelectronic Engineering, Harbin Engineering University, 
      Harbin 150001, China.
FAU - Dai, Jichun
AU  - Dai J
AD  - College of Physics and Optoelectronic Engineering, Harbin Engineering University, 
      Harbin 150001, China.
FAU - Zhou, Gaoqian
AU  - Zhou G
AD  - College of Physics and Optoelectronic Engineering, Harbin Engineering University, 
      Harbin 150001, China.
FAU - Sun, Jiapeng
AU  - Sun J
AD  - College of Physics and Optoelectronic Engineering, Harbin Engineering University, 
      Harbin 150001, China.
LA  - eng
GR  - (52271344)/National Natural Science Foundation of China/
GR  - (2018YFC0310102)/National Key R & D plan of the Ministry of science and 
      technology/
GR  - (6141B020702)/Joint fund for weapons and equipment/
GR  - (LH2021E032)./Natural Science Foundation of Heilongjiang Province of China/
PT  - Journal Article
DEP - 20230523
PL  - Switzerland
TA  - Nanomaterials (Basel)
JT  - Nanomaterials (Basel, Switzerland)
JID - 101610216
PMC - PMC10254155
OTO - NOTNLM
OT  - integrated chip temperature measurement
OT  - polymer composite film
OT  - ratiometric thermometry
OT  - temperature sensing
OT  - upconversion nanomaterials
COIS- The authors declare no conflict of interest.
EDAT- 2023/06/10 15:14
MHDA- 2023/06/10 15:15
PMCR- 2023/05/23
CRDT- 2023/06/10 01:19
PHST- 2023/04/29 00:00 [received]
PHST- 2023/05/17 00:00 [revised]
PHST- 2023/05/19 00:00 [accepted]
PHST- 2023/06/10 15:15 [medline]
PHST- 2023/06/10 15:14 [pubmed]
PHST- 2023/06/10 01:19 [entrez]
PHST- 2023/05/23 00:00 [pmc-release]
AID - nano13111704 [pii]
AID - nanomaterials-13-01704 [pii]
AID - 10.3390/nano13111704 [doi]
PST - epublish
SO  - Nanomaterials (Basel). 2023 May 23;13(11):1704. doi: 10.3390/nano13111704.