PMID- 37420559 OWN - NLM STAT- PubMed-not-MEDLINE DCOM- 20230710 LR - 20230718 IS - 1424-8220 (Electronic) IS - 1424-8220 (Linking) VI - 23 IP - 12 DP - 2023 Jun 7 TI - Multiple-Degree-of-Freedom Modeling and Simulation for Seismic-Grade Sigma-Delta MEMS Capacitive Accelerometers. LID - 10.3390/s23125394 [doi] LID - 5394 AB - The high-order mechanical resonances of the sensing element in a high-vacuum environment can significantly degrade the noise and distortion performance of seismic-grade sigma-delta MEMS capacitive accelerometers. However, the current modeling approach is unable to evaluate the effects of high-order mechanical resonances. This study proposes a novel multiple-degree-of-freedom (MDOF) model to evaluate the noise and distortion induced by high-order mechanical resonances. Firstly, the MDOF dynamic equations of the sensing element are derived using the principle of modal superposition and Lagrange's equations. Secondly, a fifth-order electromechanical sigma-delta system of the MEMS accelerometer is established in Simulink based on the dynamic equations of the sensing element. Then, the mechanism through which the high-order mechanical resonances degrade the noise and distortion performances is discovered by analyzing the simulated result. Finally, a noise and distortion suppression method is proposed based on the appropriate improvement in high-order natural frequency. The results show that the low-frequency noise drastically decreases from about -120.5 dB to -175.3 dB after the high-order natural frequency increases from about 130 kHz to 455 kHz. The harmonic distortion also reduces significantly. FAU - Wang, Xuefeng AU - Wang X AD - State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China. FAU - Zhang, Penghao AU - Zhang P AD - State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China. FAU - Ding, Shijin AU - Ding S AD - State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China. LA - eng PT - Journal Article DEP - 20230607 PL - Switzerland TA - Sensors (Basel) JT - Sensors (Basel, Switzerland) JID - 101204366 SB - IM MH - *Micro-Electrical-Mechanical Systems MH - Computer Simulation MH - Records MH - Vacuum MH - Accelerometry PMC - PMC10305370 OTO - NOTNLM OT - MEMS accelerometers OT - electromechanical modeling OT - multiple-degree-of-freedom OT - noise OT - sigma-delta COIS- The authors declare no conflict of interest. EDAT- 2023/07/08 10:42 MHDA- 2023/07/10 06:42 PMCR- 2023/06/07 CRDT- 2023/07/08 01:10 PHST- 2023/05/06 00:00 [received] PHST- 2023/06/03 00:00 [revised] PHST- 2023/06/05 00:00 [accepted] PHST- 2023/07/10 06:42 [medline] PHST- 2023/07/08 10:42 [pubmed] PHST- 2023/07/08 01:10 [entrez] PHST- 2023/06/07 00:00 [pmc-release] AID - s23125394 [pii] AID - sensors-23-05394 [pii] AID - 10.3390/s23125394 [doi] PST - epublish SO - Sensors (Basel). 2023 Jun 7;23(12):5394. doi: 10.3390/s23125394.