PMID- 37991837
OWN - NLM
STAT- MEDLINE
DCOM- 20231211
LR  - 20231217
IS  - 1944-8252 (Electronic)
IS  - 1944-8244 (Linking)
VI  - 15
IP  - 48
DP  - 2023 Dec 6
TI  - Enhanced Ultrasound Transmission through Skull Using Flexible Matching Layer with 
      Gradual Acoustic Impedance.
PG  - 55510-55517
LID - 10.1021/acsami.3c13872 [doi]
AB  - Transcranial ultrasound imaging and therapy have gained significant attention due 
      to their noninvasive nature, absence of ionizing radiation, and portability. 
      However, the presence of the skull, which has a high acoustic impedance, presents 
      a challenge for the penetration of ultrasound into intracranial tissue. This 
      leads to a low transmission of ultrasound through the skull, hindering energy 
      focusing and imaging quality. To address this challenge, we propose a novel 
      approach that utilizes a flexible matching layer with gradual acoustic impedance 
      to enhance ultrasound transmission through the skull. This matching layer is 
      constructed using Poly(dimethylsiloxane) (PDMS)/tungsten powders as the 
      structural component responsible for the gradual impedance, while agarose serves 
      as the flexible matrix. Our simulation and experimental results demonstrate that 
      the matching layer with an exponential gradual acoustic impedance significantly 
      improves the ultrasound transmission coefficient across a wide frequency range 
      compared to traditional quarter wavelength matching layers. Specifically, at 2 
      MHz, the maximum transmission coefficient reaches 49.5%, more than four times 
      higher than that of the skull without a matching layer (only 11.7%). 
      Additionally, the good flexibility of our matching layer ensures excellent 
      adhesion to the curved surface of the skull, further enhancing its application 
      potential in transcranial ultrasound imaging and therapy. The improved 
      transmission performance allows for a lower ultrasound transmission power, 
      effectively addressing overheating and safety issues.
FAU - Chen, Tiantian
AU  - Chen T
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Chen, Jie
AU  - Chen J
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Yi, Zhenyu
AU  - Yi Z
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Zheng, Congqin
AU  - Zheng C
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Zhou, Linming
AU  - Zhou L
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Wu, Yongjun
AU  - Wu Y
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Cai, Feiyan
AU  - Cai F
AD  - Paul C. Lauterbur Research Center for Biomedical Imaging, Shenzhen Institutes of 
      Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.
FAU - Qin, Jiale
AU  - Qin J
AD  - Department of Ultrasound, Women's Hospital, Zhejiang University School of 
      Medicine, Hangzhou, Zhejiang 310006, China.
FAU - Hong, Zijian
AU  - Hong Z
AUID- ORCID: 0000-0002-3491-0884
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
FAU - Huang, Yuhui
AU  - Huang Y
AUID- ORCID: 0000-0001-7493-0487
AD  - School of Materials Science and Engineering, State Key Laboratory of Silicon and 
      Advanced Semiconductor Materials, Zhejiang University, Hangzhou, Zhejiang 310027, 
      China.
LA  - eng
PT  - Journal Article
DEP - 20231122
PL  - United States
TA  - ACS Appl Mater Interfaces
JT  - ACS applied materials & interfaces
JID - 101504991
SB  - IM
MH  - Electric Impedance
MH  - Ultrasonography
MH  - *Skull/diagnostic imaging
MH  - *Acoustics
MH  - Computer Simulation
OTO - NOTNLM
OT  - acoustic field
OT  - acoustic impedance
OT  - gradual matching layer
OT  - ultrasonic properties of skull
OT  - ultrasonic transmission performance
EDAT- 2023/11/22 12:43
MHDA- 2023/12/11 12:42
CRDT- 2023/11/22 11:54
PHST- 2023/12/11 12:42 [medline]
PHST- 2023/11/22 12:43 [pubmed]
PHST- 2023/11/22 11:54 [entrez]
AID - 10.1021/acsami.3c13872 [doi]
PST - ppublish
SO  - ACS Appl Mater Interfaces. 2023 Dec 6;15(48):55510-55517. doi: 
      10.1021/acsami.3c13872. Epub 2023 Nov 22.